Disco Corporation
DISCO24 · BK · Technology / Semiconductor Equipment & Materials
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About
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, the company is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, it leases precision machines; and purchases and sells used machines. Additionally, the company manufactures and sells precision diamond abrasive tools; and offers chargeable processing services. Disco Corporation was founded in 1937 and is based in Ota, Japan.
Company Details
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CEOMr. Kazuma Sekiya
- Employees5.55K
- Headquarters13-11 Omori-Kita 2-chome, Ota, Japan, 143-8580, Thailand
- Websitehttps://www.disco.co.jp
Leadership
- Mr. Kazuma SekiyaRepresentative Executive Officer, President, CEO, COO, CIO, Chief Ethics Officer & Director · b. 1966
- Mr. Takao TamuraManaging Exec Ofcr., CFO, Chief Env. & Privacy Officer, GM of Corp. Support Div. and Director · b. 1955
- Mr. Noboru YoshinagaExecutive VP, Representative Executive Officer, GM of Sales Division & Director · b. 1957
- Naoki AbeManaging Executive Officer & GM of Purchasing Division · b. 1953
- Yutaka NishimuraExecutive Officer, Office Manager, Information Systems Manager & Hiroshima General Affairs Manager · b. 1962
- Ryuichiro KobaManager of Investor Relations Office