MI Technovation Bhd
5286 · KLSE · Technology / Semiconductor Equipment & Materials
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About
Mi Technovation Berhad, an investment holding company, engages in the design, development, manufacturing, and sales of semiconductor manufacturing equipment in Southeast Asia, Northeast Asia, and North America. It operates through Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Semiconductor Solutions Business Unit, and Others segments. The company offers die sorting and smart binning equipment, laser bonding and precision bonding equipment, test handling equipment, and vision inspection equipment; solder spheres; semiconductor wafer, semiconductor devices, and modules; and electric powertrain integration system and related components. It is also involved in research and development, manufacturing, sales and marketing of specific process and application in assembly and packaging solutions to customers; and wafer level chip scale packaging sorting machines, as well as provides maintenance services and technical support. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.
Company Details
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CEOMr. Kuang Eng Oh
- Employees594
- HeadquartersNo.20, Medan Bayan Lepas Technoplex, Bayan Lepas, Malaysia, 11900, Malaysia
- Websitehttps://mi-technovation.com
Leadership
- Mr. Kuang Eng OhGroup CEO & Executive Director · b. 1970
- Madam Shiao Voon YongGroup CFO & Executive Director · b. 1970
- Mr. Chee Kheong TeoCEO of Semiconductor Equipment Business Unit & Executive Director · b. 1973
- Madam Tee Ni OngVice President of HR & Administrative of Semiconductor Equipment Business Unit · b. 1984
- Mr. Chun Kang TungChief Technical Officer for Semiconductor Equipment Business Unit · b. 1984
- Mr. Tirng Kaai ChanChief Operations Officer for Semiconductor Equipment Business Unit · b. 1989
- Mr. Kah Wai SeetChief Financial Officer for Semiconductor Equipment Business Unit
- Mr. Chang-Ku ShihChief Financial Officer of Semiconductor Material Business Unit · b. 1971
- Mr. Ching-Jui WangChief Technology Officer of Semiconductor Material Business Unit · b. 1969
- Kevin TanChief Executive Officer of Semiconductor Material Business Unit
Financials
Income Statement
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Stock Splits
- Sep 1, 2026203:200
- Dec 4, 2019479156:319437