Duksan Hi Metal Co.Ltd
077360 · KQ · Technology / Semiconductors & Semiconductor Equipment
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About
Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic component keep being developed; and solder powder, a substance of solder paste that is used for soldering PCBs and devices. The company also provides anisotropic conductive film (ACF) for directional electrical contact and chemical bonding, such as display, drive IC, PCB, etc.; conductive particle, a component of ACF that anisotropically controls electrical current; cored solder ball, which forms bumps between a substrate and a chip; low alpha tin for solving the problem of soft errors occurred in chips; silver nanowires; thermally conductive pastes; and EMI shielding pastes. The company was founded in 1999 and is headquartered in Ulsan, South Korea. Duksan Hi Metal Co.,Ltd is a subsidiary of DUKSAN group.
Company Details
- SectorTechnology
- IndustrySemiconductors & Semiconductor Equipment
- CEOMr. Jun-Ho Lee
- Employees199
- Headquarters66, Muryong 1-ro, Ulsan, South Korea, Korea
- Websitehttps://www.dshm.co.kr
Leadership
- Mr. Jun-Ho LeeCo-CEO & Representative Director · b. 1946
- Gil-Yeon KimCo-Chief Exec. Officer · b. 1963
- Mr. Su-Hoon LeeManaging Director · b. 1976
- Keum-Deuk LeeManaging Director · b. 1965
- Han-Sung YooSr. Managing Director · b. 1963
- Young-Ro ChoiManaging Director · b. 1957
- Seong-gi KangManaging Director
Financials
Income Statement
Balance Sheet
Cash Flow
Earnings
Key Statistics & Ratios
Dividends
Stock Splits
- Apr 14, 20222:1
- Feb 6, 20151109:1875
- Apr 17, 20085:2
- Dec 27, 200611:10
- Dec 28, 200521:20