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Hpsp Co Ltd
403870 · KQ · Technology / Semiconductor Equipment & Materials
54,700KRW+4950.00 (+9.95%)
Price History
Full chartMarket Stats
Previous Close49,750
Open50,600
Day Range50,300 – 55,300
52-Week Range27,400.08 – 92,000
Volume1.81M
Market Cap5.33T
P/E (TTM)0.00
Forward P/E0.00
Dividend Yield0.76%
Beta1.59
50-Day Avg47,468
200-Day Avg45,698.75
About
HPSP Co., Ltd. manufactures and sells high pressure annealing semiconductor equipment for the semiconductor industry in South Korea. It offers GENI-SYS, a high-pressure hydrogen annealing equipment; and GENI and GENI-SE. The company also provides after-sales service for products; and sells parts. HPSP Co., Ltd. was founded in 2005 and is headquartered in Hwaseong-si, South Korea.
Company Details
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CEOMr. Choonheung Lee
- Employees0
- Headquarters26, Samsung 1-ro 1-gil, Hwaseong-si, South Korea, 18449, Korea
- Websitehttps://www.thehpsp.com
Leadership
- Kaho ChiuExecutive Director · b. 1967
- Manuel Scott RiveraVice President · b. 1964
- Hosoon LeeVice President · b. 1962
- Beom-Jun KangExecutive Director · b. 1973
- Mr. Choonheung LeeChief Executive Officer
- Mr. Suhyun LeeCFO & Director · b. 1980
- Mr. Kevin KiDu LeeExecutive Director · b. 1972
Financials
Income Statement
Balance Sheet
Cash Flow
Earnings
Key Statistics & Ratios
Market Cap5.33T
Enterprise Value4.30T
Trailing P/E0.00
Forward P/E0.00
Price / Sales32.76
Price / Book14.40
Revenue (TTM)162.79B
Gross Profit (TTM)119.81B
EBITDA91.57B
Profit Margin52.66%
Operating Margin61.39%
Return on Equity29.44%
Return on Assets15.40%
Shares Outstanding81.42M
Shares Float64.40M
Beta1.59
Dividend Yield0.76%
Dividend Rate500
Payout Ratio47.66%
Dividends
20251×
500.00Dec 29, 2025
20241×
600.00Dec 27, 2024
20231×
150.00Dec 27, 2023
20221×
37.50Dec 28, 2022
Stock Splits
- Mar 16, 20234:1