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Hwatsing Technology Co. Ltd. A
688120 · SHG · Technology / Semiconductor Equipment & Materials
200.00CNY-2.50 (-1.23%)
Price History
Full chartMarket Stats
Previous Close202.50
Open204.50
Day Range197.20 – 210.50
52-Week Range89.82 – 374.85
Volume9.07M
Market Cap112.87B
P/E (TTM)98.03
Forward P/E0.00
EPS2.32
Dividend Yield0.18%
Beta0.47
50-Day Avg256.47
200-Day Avg186.26
About
Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Company Details
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CEOMr. Tongqing Wang
- Employees2.65K
- HeadquartersNo. 11, Juxing Road, Tianjin, China, 300350, China
- Websitehttps://www.hwatsing.com
Leadership
- Mr. Tongqing WangGM & Chairman · b. 1983
- Mr. Huaixu WangFinancial Director & Director · b. 1972
- Mr. Xinchun LuChief Scientist · b. 1966
- Mr. Kun LiExecutive VP & Director · b. 1979
- Mr. Ke WangDeputy GM & Employee Director · b. 1980
- Mr. Zhenyin ChenBoard Secretary · b. 1986
- Feng WangAccounting Supervisor
- Mr. Fu Sheng LiuDeputy General Manager · b. 1976
Financials
Income Statement
Balance Sheet
Cash Flow
Earnings
Key Statistics & Ratios
Market Cap112.87B
Enterprise Value122.22B
Trailing P/E98.03
Forward P/E0.00
Price / Sales21.13
Price / Book15.94
EPS2.32
Book Value16.02
Revenue (TTM)5.34B
Gross Profit (TTM)2.14B
EBITDA1.23B
Profit Margin21.37%
Operating Margin18.96%
Return on Equity15.32%
Return on Assets5.01%
Shares Outstanding496.28M
Shares Float285.82M
Beta0.47
Dividend Yield0.18%
Dividend Rate0.40
Payout Ratio18.58%
Dividends
20261×
0.40Jun 10, 2026
20251×
0.26Jul 3, 2025
20241×
0.26Jul 2, 2024
20231×
0.16Jun 27, 2023
Stock Splits
- Jun 10, 20261.4:1
- Jul 3, 20251.49:1
- Jul 2, 20241.49:1
- Jun 27, 20231.49:1