China Chippacking Technology Co. Ltd. A
688216 · SHG · Technology / Semiconductors
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About
China Chippacking Technology Co.,Ltd. provides integrated circuit packaging and testing services in China and internationally. The company offers CPC, ECPC, DFN, QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, tODAY, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS,FC, 5G nitride automotive, home RF devices in plastic packages, such as QFN/DFN, CQFN/CDFN, SOT, DIP, and PDFN packaging forms. Its products are used in consumer electronics, information and communication, smart home, IoT, industrial automation control, and automotive electronics applications. The company also provides power device packaging and testing, and wafer testing services. The company was founded in 2006 and is based in Dongguan, China.
Company Details
- SectorTechnology
- IndustrySemiconductors
- CEOMr. Dazhong Liang
- Employees2.07K
- HeadquartersQipai Building, Dongguan, China, 523330, China
- Websitehttps://www.chippacking.com
Leadership
- Mr. Dazhong LiangChairman of the Board & GM · b. 1959
- Mr. Zewei LiAssistant GM, CFO & Director · b. 1979
- Mr. Zhengguo WenDeputy GM & Board Secretary · b. 1980
- Mr. Xilin RaoDeputy General Manager · b. 1973
- Mr. Yang Bao WangDeputy General Manager · b. 1968
- Jia Xian CaiAccounting Supervisor
- Mr. Bingchuan YiCore Technical Personnel · b. 1983
- Mr. Zhang YiSenior Engineer · b. 1995
- Mr. Xin LinExecutive Officer · b. 1990