Jiangsu HHCK Advanced Materials Co. Ltd. A

688535 · SHG · Technology / Semiconductor Equipment & Materials

73.08CNY-2.79 (-3.68%)

Price History

Full chart

Market Stats

Previous Close75.87

Open77.12

Day Range72.35 – 79.71

52-Week Range58.05 – 199.99

Volume7.21M

Market Cap13.95B

P/E (TTM)278.23

Forward P/E0.00

EPS0.35

Dividend Yield0.10%

Beta2.08

50-Day Avg101.57

200-Day Avg101.41

About

Jiangsu HHCK Advanced Materials Co., Ltd. engages in the research, development, production, and sale of semiconductor packaging materials, such as epoxy molding compounds and electronic adhesives in China. The company offers semiconductor devices, integrated circuits, special devices, and LEDs, as well as electronic packaging materials, such as brackets. Its products are used in semiconductor packaging, structural component packaging, and board-level assembly; chip bonding, chip-level molding. Jiangsu HHCK Advanced Materials Co., Ltd. was founded in 2010 and is based in Lianyungang, China.

Company Details

SectorTechnology
IndustrySemiconductor Equipment & Materials
CEODr. Jianglong Han
Employees942
HeadquartersNo. 66, Dongfang Avenue, Lianyungang, China, 222047, China
Websitehttps://www.hhck-em.com

Leadership

Dr. Jianglong HanChairman of the Board & GM · b. 1965
Mr. Dongfeng DongCFO, Deputy GM, Secretary & Accounting Supervisor · b. 1981
Mr. Xingming ChengDirector & Deputy GM · b. 1964

Financials

Income Statement

Currency: CNY	2021-12-31	2022-12-31	2023-12-31	2024-12-31	2025-12-31
Total Revenue	347.20M	303.22M	282.90M	331.63M	458.06M
Growth (%)	-	-12.67%	-6.70%	+17.23%	+38.12%
Cost of Revenue	246.02M	221.33M	206.86M	246.62M	335.96M
Gross Profit	101.18M	81.89M	76.05M	85.01M	122.10M
Gross Margin	29.14%	27.01%	26.88%	25.63%	26.66%
Operating Expense	43.91M	40.18M	57.20M	61.05M	115.75M
Operating Income	57.27M	41.71M	18.85M	23.96M	6.34M
Operating Margin	16.49%	13.76%	6.66%	7.22%	1.38%
EBITDA	-	52.69M	46.14M	63.29M	57.90M
EBITDA Margin	-	17.38%	16.31%	19.08%	12.64%
Net Income	47.60M	41.23M	31.64M	40.06M	24.25M
Net Income Margin	13.71%	13.60%	11.18%	12.08%	5.29%
R&D	18.84M	18.29M	24.64M	26.41M	50.06M
R&D as % of Total Revenue	5.43%	6.03%	8.71%	7.96%	10.93%
Interest Expense	4.04M	39.06K	725.42K	1.96M	6.94M
Interest Expense % of Total Revenue	1.16%	0.01%	0.26%	0.59%	1.51%

Balance Sheet

Currency: CNY	2021-12-31	2022-12-31	2023-12-31	2024-12-31	2025-12-31
Total Assets	496.41M	505.71M	1.23B	1.40B	3.16B
Total Liabilities	152.75M	126.88M	203.19M	363.30M	984.46M
Total Equity	343.66M	378.83M	1.03B	1.04B	2.17B
Cash	87.48M	80.82M	36.38M	56.03M	568.58M
Net Debt	-	-	15.75M	96.12M	77.58M

Cash Flow

Currency: CNY	2021-12-31	2022-12-31	2023-12-31	2024-12-31	2025-12-31
Operating Cash Flow	1.69M	11.95M	31.61M	2.98M	7.68M
Capital Expenditure	9.22M	9.73M	71.46M	66.19M	46.01M
Free Cash Flow	-7.53M	2.22M	-39.86M	-63.22M	-38.34M
Dividends Paid	9.33M	6.05M	16.76M	33.96M	22.22M
FCF to OCF	-446.08%	18.59%	-126.11%	-2123.85%	-499.41%
Dividend Paid to FCF	-123.88%	272.38%	-42.04%	-53.73%	-57.95%

Key Statistics & Ratios

Market Cap13.95B

Enterprise Value16.75B

Trailing P/E278.23

Forward P/E0.00

Price / Sales18.66

Price / Book7.34

EPS0.35

Book Value16.12

Revenue (TTM)747.76M

Gross Profit (TTM)549.45M

EBITDA95.13M

Profit Margin6.71%

Operating Margin10.94%

Return on Equity3.06%

Return on Assets1.62%

Shares Outstanding143.27M

Shares Float91.46M

Beta2.08

Dividend Yield0.10%

Dividend Rate0.10

Payout Ratio66.70%

Dividends

20261×

0.10Apr 30, 2026

20251×

0.14Jul 29, 2025

20242×

0.07Oct 28, 20240.20May 31, 2024

20231×

0.14Jul 10, 2023

Stock Splits

Apr 30, 20261.48:1