SJ Semiconductor Corp

SJ Semiconductor Corporation operates as an integrated circuit wafer-level advanced packaging and testing company in China and internationally. It focuses on the mid-stage silicon wafer processing and back-end advanced packaging segments of the integrated circuit advanced packaging and testing industry. It provides middle-end-of-line manufacturing and testing services, as well as develops advanced 3D Multi-Die integration technology and solutions. The company offers integrated circuit chips. Its products include bumping include copper pillar bump, copper pillar micro bump, copper-nickel-gold micro bumps, tin silver bumps, and ball implant bump; wafer testing; multi-chip integrated packaging. It provides mid-section bump, wafer testing, wafer-level chip packaging, and research and development services. The company was founded in 2014 and is based in Jiangyin, China.