Tong Hsing Electronic Industries Ltd
6271 · TW · Technology / Semiconductor Equipment & Materials
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About
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, and packaging, and image testing. The company also provides high frequency wireless communication modules and power semiconductors module packaging products; and customized module packaging and testing comprising hybrid integrated circuit modules and biomedical products. Its products are used in automotive, handset, aerospace and network, medical, and others. The company was incorporated in 1974 and is based in New Taipei City, Taiwan.
Company Details
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CEOMr. Shao-Ping Lu
- Employees0
- Headquarters55 Lane 365, New Taipei City, Taiwan, Taiwan
- Websitehttps://www.theil.com
Leadership
- Mr. Shao-Ping LuGM & President
- Ms. Chia-Li HuangAccounting Supervisor, VP, COO, CFO & Director
- Shih-Yi YuChief Internal Auditor
Financials
Income Statement
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Stock Splits
- Aug 9, 202313:10
- Dec 1, 20229:10
- Nov 19, 2020856:1133
- Jun 24, 2011640:629
- Jun 7, 2010568:559
- Aug 13, 200921:20
- Aug 4, 2008962:907
- Jul 25, 200721:20