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BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V.

BSI · XETRA · Technology / Semiconductor Equipment & Materials

153.65EUR-4.15 (-2.63%)

Price History

Full chart

Market Stats

Previous Close157.80
Open156.80
Day Range153.25 – 156.80
52-Week Range120.21 – 324.20
Volume1.17K
Market Cap16.25B
P/E (TTM)78.40
Forward P/E29.41
EPS2.62
Dividend Yield0.85%
Beta1.33
50-Day Avg200.95
200-Day Avg213.61

About

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Company Details

  • SectorTechnology
  • IndustrySemiconductor Equipment & Materials
  • CEOMr. Richard W. Blickman
  • Employees1.95K
  • HeadquartersRatio 6, Duiven, Netherlands, 6921 RW, Germany
  • Websitehttps://www.besi.com

Leadership

  • Mr. Richard W. BlickmanChairman of Management Board, President & CEO · b. 1954
  • Andrea Kopp-BattagliaSenior Vice President of Finance · b. 1978
  • Mr. Henk-Jan Jonge PoerinkSenior Vice President of Global Operations · b. 1970
  • Mr. Chris ScanlanSenior Vice President of Technology · b. 1969
  • Mr. Edmond FrancoVice President of Corporate Development
  • Mr. Rene W. HendriksSenior Vice President of Sales - North America & Europe · b. 1961
  • Mr. Peter WiednerSenior Vice President of Sub Micron Die Attach · b. 1970
  • Mr. Jong Kwon ParkSenior Vice President of Sales & Customer Support - APAC · b. 1966
  • Mr. Jeroen KleijburgSenior Vice President of Packaging · b. 1974
  • Mr. Christoph ScheiringSenior Vice President of Die Attach · b. 1970

Financials

Income Statement

Currency: EUR2021-12-312022-12-312023-12-312024-12-312025-12-31
Total Revenue749.30M722.87M578.86M607.47M591.33M
Growth (%)--3.53%-19.92%+4.94%-2.66%
Cost of Revenue302.48M279.80M203.07M211.53M217.06M
Gross Profit446.82M443.07M375.79M395.94M374.27M
Gross Margin59.63%61.29%64.92%65.18%63.29%
Operating Expense129.24M148.96M162.40M200.35M201.22M
Operating Income317.58M294.12M213.39M195.59M173.06M
Operating Margin42.38%40.69%36.86%32.20%29.27%
EBITDA-310.69M245.09M233.79M212.74M
EBITDA Margin-42.98%42.34%38.49%35.98%
Net Income282.42M240.65M177.08M181.99M131.64M
Net Income Margin37.69%33.29%30.59%29.96%22.26%
R&D36.38M53.95M56.44M74.31M80.97M
R&D as % of Total Revenue4.86%7.46%9.75%12.23%13.69%
Interest Expense10.96M12.20M11.66M16.67M25.07M
Interest Expense % of Total Revenue1.46%1.69%2.01%2.74%4.24%

Balance Sheet

Currency: EUR2021-12-312022-12-312023-12-312024-12-312025-12-31
Total Assets1.14B1.14B896.55M1.23B1.11B
Total Liabilities524.77M506.65M475.14M733.21M697.35M
Total Equity619.27M628.53M421.41M501.26M416.40M
Cash451.39M491.69M188.48M342.32M372.99M
Net Debt--112.02M186.15M134.01M

Cash Flow

Currency: EUR2021-12-312022-12-312023-12-312024-12-312025-12-31
Operating Cash Flow277.85M271.87M208.57M201.08M178.14M
Capital Expenditure28.35M28.39M28.02M31.48M41.79M
Free Cash Flow249.50M243.48M180.55M169.61M136.35M
Dividends Paid129.36M269.47M222.11M171.53M172.81M
FCF to OCF89.80%89.56%86.57%84.35%76.54%
Dividend Paid to FCF51.85%110.67%123.02%101.14%126.74%

Earnings

Report DateDec 31, 2021Mar 31, 2022Jun 30, 2022Sep 30, 2022Dec 31, 2022Mar 31, 2023Jun 30, 2023Sep 30, 2023Dec 31, 2023Mar 31, 2024Jun 30, 2024Sep 30, 2024Dec 31, 2024Mar 31, 2025Jun 30, 2025Sep 30, 2025Dec 31, 2025Mar 31, 2026Jul 23, 2026Oct 22, 2026
EPS Estimate------------------1.131.31
EPS Actual0.800.810.900.670.470.410.630.420.670.410.510.570.730.390.390.310.540.651.10-
Surprise-------------------2.67%-
Timing------------------After-hoursAfter-hours

Key Statistics & Ratios

Market Cap16.25B
Enterprise Value15.00B
Trailing P/E78.40
Forward P/E29.41
PEG Ratio0.64
Price / Sales22.15
Price / Book26.34
EPS2.62
Book Value7.09
Revenue (TTM)733.83M
Gross Profit (TTM)470.30M
EBITDA278.67M
Profit Margin28.44%
Operating Margin43.54%
Return on Equity44.87%
Return on Assets14.74%
Shares Outstanding79.13M
Shares Float71.98M
Beta1.33
Dividend Yield0.85%
Dividend Rate1.58
Payout Ratio60.80%

Dividends

20261×
1.58Apr 27, 2026
20251×
2.18Apr 25, 2025
20241×
2.15Apr 29, 2024
20231×
2.85Apr 28, 2023
20221×
3.33May 3, 2022
20121×
0.22Apr 27, 2012
20111×
0.20May 2, 2011